Home Tag "Meyer Burger awarded two contracts for its DS 261 wire saws for about CHF 17.5 million from existing customers in the semiconductor industry"

Meyer Burger awarded two contracts for its DS 261 wire saws for about CHF 17.5 million from existing customers in the semiconductor industry

Meyer Burger Technology Ltd (SIX Swiss Exchange: MBTN) today announced the successful conclusion of repeat orders from two existing customers for its versatile DS 261 wire saw equipment for slicing and wafering applications in the semiconductor industry. In response to the strong growing global demand for semi-wafers, the customers, global manufacturers in the semiconductor industry, […]